Thermal Conductivity Filler Powder Dispersion Machine, Active Coating Machine, Shaping and Stirring Mill

Release time:

2026-01-06 08:50

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Traditional, unmodified thermal-conductivity fillers—whether they’re aluminum oxide, boron nitride, or silicon carbide—each have inherent shortcomings: poor compatibility with organic matrices leads to easy agglomeration, thereby disrupting the internal thermal-conductivity pathways of the material; low surface activity makes them prone to interfacial reactions with the matrix, compromising the material’s mechanical properties; and inadequate dispersibility results in fluctuations in thermal-conductivity efficiency, increasing quality risks in end products. The core function of coating modification equipment is to systematically design processes tailored specifically to these fillers, providing customized surface-modification solutions that address these industry pain points at their root.

At the technical process level, the coating modification machine has achieved... The dual breakthrough of “precise encapsulation and efficient dispersion” hinges on a core process that consistently revolves around “adaptability” and “stability.” First, the equipment uses high-speed mixing to remove impurities and homogenize the raw thermally conductive fillers, ensuring a uniform particle size distribution and laying a solid foundation for subsequent encapsulation—this step directly determines the consistency of the encapsulant layer’s thickness. Next, during the core encapsulation stage, when dry-process encapsulation is applied to oxide fillers such as alumina, the equipment employs a twin-screw mixer coupled with a high-speed atomization spray system to evenly coat the filler surface with modifying agents like silane coupling agents. At the same time, the equipment precisely controls the mixing speed and the temperature of the cylinder wall, enabling the modifying agent molecules to form strong chemical bonds with the hydroxyl groups on the filler surface. ， Ensure that the modified filler particles are uniformly dispersed and free from agglomeration, directly meeting the feed requirements for subsequent composite material processing.

The coating and modification machine boasts exceptional process adaptability, seamlessly accommodating fillers with particle sizes ranging from micrometer to nanometer levels. Whether the thermal conductive fillers are spherical, flaky, or fibrous, precise coating can be achieved by adjusting stirring methods, spray pressure, and temperature parameters. It is compatible with mainstream thermal conductive filler types such as alumina, boron nitride, silicon carbide, and graphene.

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