Polishing Material Powder Modification Machine, Surface Modification Machine, Coating Equipment

Release time:

2026-02-12 08:44

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The core mission of polishing materials is to achieve global surface planarization and high-precision finishing of workpieces through the synergistic effects of physical abrasion and chemical action. Their application scenarios have already deeply penetrated into numerous strategic emerging fields. In the semiconductor industry, particularly in the manufacturing of memory chips and logic chips, polishing materials must meet nanometer-level requirements. Abrasive material Control and The requirement for high purity at the ppb level directly affects wafer yield and chip performance. In the field of third-generation semiconductors, silicon carbide (SiC), as a highly hard and brittle material, demands that its polishing process strike a balance between high material removal rate and low surface roughness—this is the core challenge hindering its large-scale application. In the processing of optical components and precision ceramics, the dispersion stability and wear resistance of polishing materials directly determine the product’s light transmittance, surface finish, and service life.

Traditional polishing materials are widely available. Abrasive material Problems such as poor compatibility with bonding agents and high defect rates during polishing make it difficult to meet the demands of high-end manufacturing. However, polished materials that have undergone coating modification and machining can be customized for performance according to different application scenarios. They not only meet the ultra-precise polishing requirements for semiconductor wafers but also accommodate the specialized processing needs of fields such as automotive electronics and optical instruments, thereby comprehensively expanding the application boundaries of polishing materials.

The core advantage of the coating and modification machine lies in its modular collaborative design, which enables uniform coating and performance enhancement of the polished abrasive particle surfaces. Its processing technology runs throughout... The entire process—“pre-processing, precise encapsulation, and finished-product collection”—features stringent parameter control at every step to ensure processing quality.

During the feeding stage, the equipment uses a negative-pressure feeding system to feed ultrafine polishing agents. Abrasive material The material is fed into the processing chamber at a constant speed, while a dedicated modifier supply module precisely proportionates modifying agents such as silane coupling agents and polymeric dispersants, ensuring high accuracy in the ratio between abrasive particles and modifiers. The equipment uses high-frequency stirring to... Abrasive material Fully in contact with the modifier, the modifier in... Abrasive material A uniformly thick nanoscale coating is formed on the surface, effectively inhibiting... Abrasive material Reunion. For hard abrasive particles such as diamonds and alumina, coating them with materials like manganese dioxide or polymers can help balance grinding hardness with chemical reactivity. For materials like rare-earth polishing powders, organic coatings can enhance their compatibility with resin binders.

The coating and modification machine boasts exceptional process compatibility, making it suitable for a wide range of polishing abrasives—including cerium oxide, diamond, aluminum oxide, and silicon carbide. It supports various coating processes, such as inorganic coating, organic coating, and composite coating, thereby meeting the processing requirements of diverse products like semiconductor polishing liquids, bonded abrasives, and precision polishing pads. Thanks to its modular design, this equipment can be seamlessly integrated with ultrafine pulverizers, classifiers, and other devices to form complete production lines, enabling integrated processing—from raw material refinement to surface modification—and enhancing both production continuity and product consistency.

The equipment employs a fully enclosed negative-pressure operation system, effectively controlling dust pollution during the processing and aligning with the industry’s trend toward green development. Meanwhile, by precisely controlling the thickness and composition of the coating layer, the amount of modifier used can be reduced, thereby minimizing the generation of waste liquids and waste materials and helping enterprises achieve sustainable production.

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