Scheme for Producing Electronic-Grade ATH Using a Vertical Wet Grinder Combined with a High-Speed Pulverizer


5G Communication on copper-clad laminates ( CCL ) places higher demands on dielectric properties and thermal stability. As a primary flame-retardant filler, the purity and particle-size distribution of electronic-grade aluminum hydroxide are critical.

Vertical Wet Grinder Precise hydraulic classification and high-energy-density grinding ensure that the powder exhibits an exceptionally narrow particle-size distribution, effectively mitigating the adverse impact of ultrafine fines on resin viscosity.

Compared with the past High-speed pulverizer Process: the vertical wet grinding system can increase whiteness to 96 Furthermore, metal particles generated by mechanical wear are thoroughly removed. This high-purity, highly dispersed ATH Micropowders can significantly reduce CCL Coefficient of thermal expansion at high temperatures ( CTE ), enhancing the reliability of circuit boards, is a high-end functional material that meets the demands of high-performance computing and communication equipment.

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